Thermalboard Modular PEX Radiant Heat Mass for above Floor Radiant Heat
ThermalBoard above Floor Radiant Heat Panels are a patented, highly efficient, low mass, modular radiant pex pipe underlayment system designed for use with hydronic radiant heating systems. The Thermal Board system is comprised of three grooved 5/8 Inch thick aluminum clad wood composite panels that are ready to accommodate 3/8 Inch PEX Tubing.
Immediately before application of finished flooring goods, ThermalBoard is glued then screwed (or stapled) to a standard subfloor in a pattern to accommodate a tubing layout for a particular space. Finished flooring goods may then be applied over the ThermalBoard as required. ThermalBoard heating is similar to that of underfloor heating.
